Head of Department (Semiconductor Packaging)

at Hays
Location Malaysia
Date Posted September 25, 2018
Category Engineering
Job Type Full-time

Description

Our client is a leading semiconductor company in Malaysia manufacturing power packages. They are looking for a senior leader reporting to the head of the company (Open to expats). Your new role You will be managing a team of over 50 engineers with 10 direct reports. The client is looking for someone who has lead a team of NPI/Equipment/R&D/Product Engineer/Package designers. You will need to...

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